Design007 Magazine

78 DESIGN007 MAGAZINE I JUNE 2021 alloy selected. e process flow illustrated in Figure 6 from Ticer Technologies represents a two-stage chemical etching sequence for their nickel chromium (NiCr) resistive material. With respect to circuit layer preparation, fabricators are able to image and chemically or any number of reinforced specialty resins from a vast network of global material suppliers. Resistor Process Sequence e resistor forming process will include two or three etch steps, depending on the resistor Table 2: Comparing Ticer Technologies resistive coating characteristics. Figure 6: Thin-film resistor forming process sequence.

• Design007 Magazine— June 2021
• Feature Contents — Space and Trace, The Final Frontier
• Additional Contents
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• Feature Column — A Lifetime of Star Trek
• Feature Article — Star Trek, the Original Series: An Homage from a Fan
• Feature Article — My Life in PCB Design
• Short — Hate PCB Respins? Five Ways to Reduce or Eliminate Respins
• Feature Article — Hewlett-Packard's Adoption—and Controversy—of Plated Through-Holes
• Feature Article — 'The Trouble with Tribbles'
• Feature Article — It's FR-4, Jim, But Not as We Know It!
• Feature Column — There is No 'Final' Frontier for PCB Design
• Feature Article — Star Trek: Laying a Path for Technology of Tomorrow, Today
• Column — High-Speed Serial Link PCB Design
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• Short — Intelligent Antenna Passes the Test
• Column — Some 'Exotic' PCB Processes Could Become Commonplace
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• Column — Embedding Resistor Elements, Part 2
• Short — Driving in the Snow is a Team Effort for AI Sensors
• Article — DFM 101: PCB Panelization
• Short — Book Excerpt: 'The Printed Circuit Designer's Guide to…Thermal Management: A Fabricator's Perspective,' Chapter 3: Metal-Core Boards
• Column — The IPC PCB Design Desk Reference is on Its Way
• Short — Thin Is Now in To Turn Terahertz Polarization
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• Short — ICAPE Group Offers Boots on the Ground Support in Asia
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