SMT007 Magazine

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• SMT007 Magazine — September 2020
• Featured Content — BOMs and the Supply Chain
• Additional Content
• Column — BOM: The Path to Managing Parts
• Feature Interview — The Bill Comes Due: BOMs and the Digital Twin
• Short — Packaging-free Design Quadruples Microbatteries' Energy Density
• Feature Interview — A Multi-Tenant PLM Software Solution
• Feature Interview — Whizz is Da BOM
• Feature Interview — BOM Connector: A Ready-Built Solution
• Feature Interview — BOMs and the Supply Chain From an Assembler's Point of View
• Article — Reducing the Cost of Solder Alloys Used in Wave and Selective Soldering Assembly Applications
• Electronics Industry News and Market Highlights
• Feature Interview — Luminovo Cuts BOM Waste, Improves OEM/EMS Communication
• Column — Making Progress on Uptime
• Short — Ultrasensitive Pressure Sensors Pave the Way for Robot 'Skin'
• Supplier Highlights
• Column — X-ray Imaging and BGA Rework
• Short — Excerpt: The Printed Circuit Assembler's Guide to…SMT Inspection: Today, Tomorrow, and Beyond, Chapter 6
• MilAero007 Highlights
• Interview — A Conversation With Javad EMS
• SMT007 Top Ten
• Career Opportunities Section
• Advertiser Index and Masthead
• Bookmark 1
• Bookmark 2