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ALPHA ® OM-372 High Electrochemical Reliability Ultra-Fine Feature No-Clean Solder Paste ALPHA OM-372 is designed for superior performance on assemblies with ultra-fi ne pitch components requiring excellent stencil transfer effi ciency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. ALPHA OM-372 Key Features: ● Best-in-class electrochemical reliability on fi ne pitched low standoff packages. ● Ultra-fi ne feature printing and refl ow capability down to 008004 components. ● Minimum post refl ow residue provides high reliability performance for fi ne pitch, high density designs when fl ux is entrapped under devices ● Excellent HiP/NWO Performance on high I/O count packages. ● No-Clean, Zero-Halogen

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