PCB007 Magazine

PCB007-Sep2021

Issue link: https://iconnect007.uberflip.com/i/1411055

Contents of this Issue

Navigation

Page 19 of 109

20 PCB007 MAGAZINE I SEPTEMBER 2021 Conclusion To consider all aspects of streamlining the PCB fab process, lead-time, and lot-size reduc- tion, as well as automation strategies, should be employed. Figure 6 shows one of four ma- jor automation projects in one PCB facility in Europe that reduced lead time/lot size and costs while improving quality. More exam- ples of move time and queue time with digital recipe set-up time automation can be seen in the PCB007 article about the 2018 CPCA Seminar [6] . PCB007 References 1. Wight, Oliver, "Input/Output Control—A Real- Handle on Lead Time," 3rd Quarter 1970 Production and Inventory Management, Journal of the Ameri- can Production & Inventory Control Society (APICS), pp. 9-30. 2. Matties, Barry, Bernas, Bryan, "Whelen Engi- neering Reduces Cycle Time by Building a New Au- tomated PCB Factory," The PCB Magazine, October 2015, pp. 12–39. 3. Stepinski, Alex, "The 21st Century PCB Facto- ry—Designed to Eliminate Offshore Cost Advantag- es," The PCB Magazine, June 2016, pp. 78–94. 4. Holden, Happy, "Innovative PCB Processes are Lean and Green," PCB007 Magazine, October 2018, pp. 26–33. 5. Nordskog, William H., "Queue Control: A Case Study For PCB," California Circuit Assoc. Confer- ence, Irvine, California, 1998 (archived in the I-Con- nect Technical Library). 6. Holden, Happy, "CPCA 2018 Seminar Over- view," PCB007 Magazine, May 2018, pp. 66–81. Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Packard, NanYa/Westwood, Merix, Foxconn and Gentex. Happy is the the author of Automation and Advanced Procedures in PCB Fabrication and 24 Essential Skills for Engineers. He is currently a contributing technical editor with I-Connect007. Figure 6: Recently installed bar code driven lot/setup automation for solder mask, hole filling, and legend processes in printed circuit fabrication. (Source: AWP presentation, CPCA Conference, Shanghai, China, Oct. 2018)

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Sep2021