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A new angle on bending performance – Optimal bending solutions for flex substrates info @ atotech.com To find out more, sign up to our webinars on Aurotech ® -Flex and Stanna ® -Flex. w w w.atotech.com Today's technology combines fast-paced innovation with a commitment to more sustainability, performance, and comfort. For the PCB industry, it also comes with challenges, like meeting the changing requirements that new technological gadgets bring with them. To allow substrates to achieve market-leading bending performance, Atotech has developed two new processes: Aurotech ® Flex and Stanna ® -Flex. Both offer optimal efficiency while reducing chemical waste and easing the process flow. Aurotech ® Flex is a bendable mid-phosphorus nickel finish for the plating of ENIG and ENEPIG. Stanna ® -Flex is an immersion tin plating solution specifically designed for chip on film applications and fine structures. As two highly effective solutions, each one offers best bending performance for all kinds of flexible substrates.