Issue link: https://iconnect007.uberflip.com/i/1411055
Package substrates are diverging to meet the needs of today's hybrid designs. WE HAVE YOUR SOLUTIONS © 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. Systek UVF Series 2-in-1 Via Filling and Trace Plating for RDL MacuSpec THF Series Single Step Copper Through Hole Filling Systek SAP Stress-Free Semi Additive Electroless Copper Systek ETS Embedded Trace Outerlayer for 5 Micron Line/Space Affinity 3.0 Hybrid Gold for Corrosion Free ENEPIG with Unlimited Thickness Affinity Gold 3.0 - ENEPIG Traditional ENEPIG M-Speed HF Copper Treatment for Adhesion Promotion and Signal Integrity CircuEtch High-Performance Anisotropic Flash Etch Processes Untreated Std. Treatment M-Speed 100x 100x 100x