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14 SMT007 MAGAZINE I OCTOBER 2021 Presentation Dr. Hwang will deliver a professional de- velopment course, "Solder Joint Reliabili- ty—Principle and Practice" from 9 a.m. to noon November 1; and a course on "Reliabil- ity of Electronics—Role of Intermetallic Com- pounds" from 2 to 5 p.m. November 1, at the SMTA International Conference. SMT007 Dr. Jennie S. Hwang—an inter- national businesswoman and speaker and a business and technology advisor—is a pio- neer and long-standing leader to SMT manufacturing since its inception as well as to the development and implementation of lead-free electronics technology. Among her many awards and honors, she was inducted to the International Hall of Fame–Women in Technology, elected to the National Academy of Engineering, named an R&D Star to Watch, and received a YWCA Achievement Award. Having held senior executive positions with Lockheed Martin Corp., Sherwin Williams Co., and SCM Corp., she was the CEO of International Electronic Materials Corp. and is currently CEO of H-Technologies Group, providing business, tech- nology, and manufacturing solutions. She has served on the board of Fortune-500 NYSE companies and civic and university boards; the Commerce Department's Export Council; the National Materials and Manufacturing Board; the NIST Assessment Board; as the chairman of the Assessment Board of DoD Army Research Laboratory and the chairman of the Assessment Board of Army Engineering Centers; and various national panels/committees and international leadership positions. She is the author of 600+ publications and several books and is a speaker and author on trade, business, education, and social issues. Her formal education includes four academic degrees, as well as the Harvard Business School Executive Program and Columbia University Corporate Governance Program. For more information, visit To read past columns or contact Hwang, click here. Watch & learn! In this engaging, 12-part micro webinar series, Koh Young topic experts Joel Scutchfield and Ivan Aduna examine 3D inspection, AI, CFX, connectivity and smart factory success. The first episode, "True 3D to Overcome Inspec- tion Challenges" is now available to view. In this 6-minute segment, viewers will learn about the use of True 3D to overcome inspection challenges and accurately identify coplanarity and lead-bridging is- sues, which are prevalent in small packages and BGAs. Designed to complement Koh Young's I-007e- Book, The Printed Circuit Assembler's Guide to... SMT Inspection, Today, Tomorrow and Beyond, throughout the series, present- ers Scutchfield and Aduna share highly focused educational information on the use of data gathered during the inspec- tion process. This entire webinar series can be viewed in an hour and covers a com- prehensive range of topics surrounding 3D inspection and the use of smart data gathered during the inspection process. Most of the 12 segments can be viewed in about five minutes. Visit Converting Process Data Into In- telligence and start watching, free, today! I-Connect007 Launches New Micro Webinar Series: 'Converting Process Data Into Intelligence' Presented by the Experts at Koh Young

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