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If you could hold one-micron accuracy today, you would be in good shape to support the de- velopment, but you need to be sub-micron to be able to support the long-term roadmap of that technology. If the global capability and capacity in SMT today cannot place a component below 25-mi- cron accuracy in high speed, we have an emerg- ing capability gap. e fab suppliers may have to retool or invest in new capabilities. We're going to have to develop and, as an industry, invest in new manufacturing technologies, in- cluding advanced microelectronics and high- speed placement in advanced microelectron- ics. e equipment providers in that space are really stepping up. ey see what's coming, and they're developing automation that will sup- port that as well. But I would equate where we are, as an industry today, to a time when every- body was doing through-hole and hand place- ment in SMT, and then high-end automation came into play. And there were a lot of compa- nies who just sat back and said, "We're okay," until they weren't. I do not mean to imply that SMT as we know it is going to be usurped; that would be ridiculous. Rather, high-speed and high-performance applications will demand a level of precision that cannot presently be sup- ported, and hybrid manufacturing approaches will likely become more commonplace as in- dustry marches toward the future. Johnson: ank you. Great perspective on where the industry is going forward as well, Daniel. Everitt: I appreciate your time. SMT007 Sponsored Link

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