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58 SMT007 MAGAZINE I OCTOBER 2021 threshold and inspection tolerances that mini- mize escape and false-call rates with minimum debugging effort. If you are facing produc- tion quality challenges due to your old 2D AOI equipment, it may be time to upgrade. Measurement-based Inspection Process optimization is desired by every manufacturer, as well as equipment suppliers. However, it has been difficult to realize due to the limitation of two-dimensional (2D) imag- ing, which was the de facto standard for the past decades. Not only it is difficult for 2D au- tomated optical inspection (AOI) systems to identify defects on curved and reflective sol- der joint, 2D AOI systems do not generate re- liable data. Every aspect of the 2D inspection process relies on contrast, not quantitative measurement. As such, 2D AOI users must ei- ther scrap or repair defective boards, which in- creases costs and eliminates process improve- ment opportunities. e introduction of 3D imaging to the in- spection market solved some of the problems. By measuring components and solder joints, and then offering critical height information to the inspection algorithms, us- ers could locate errors like pad overhang and insuf- ficient soldering. Howev- er, the validity of the mea- surement data remained questionable as most of the 3D AOI systems use "blob detection" to find the component body; but, this technique is sus- ceptible to external fac- tors like board warpage and component proximi- ty. Since finding the com- ponent body is the critical first step in the inspection process, it can negative- ly affect the whole inspec- tion sequence if inaccurate. Koh Young technology has overcome this challenge by using 3D technology for all com- ponent types to extract their bodies (Figure 1). True 3D measurement is processed by a parallel computing engine. While 2D inspec- tion technologies are combined with real-time PCB warp compensation to offer accurate in- spection data, the new platform goes much fur- ther. Using patented shadow-free 3D technol- ogy, we provide improved results by measur- ing every aspect of the component and solder joint in accordance with the IPC-A-610 stan- dard. is system's ability to generate a signif- icant set of reliable measurement data can be found, for example, in our KSMART analysis and optimization solutions. Ground-breaking Transparency In this hyper-competitive world, manufac- turers place ever-challenging demands on pro- cess solutions. Manufacturers want to monitor and adapt the process to achieve zero defects by accessing all the data at anytime, anywhere. ey must also cope with shorter life cycles, so Figure 1: Mapping the component body by using 3D measurement technology.