Design007 Magazine

© 2021 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. NEXT GENERATION METALLIZATION TECHNOLOGIES specifically designed to SOLVE FLEXIBLE CIRCUITRY CHALLENGES FIB Cut Blackhole LE / Eclipse LE Low etch direct metallization processes with minimal etching that enable subtractive HDI and mSAP on a wide range of materials. ViaDep 4550 Versatile electroless copper process that deposits copper with zero internal stress, enabling excellent adhesion on flex and rigid-flex designs. Systek SAP & SAP Flex Semi-additive processes for creation of initiation layers in package substrates and with excellent adhesion to flexible materials for ultra fine lines and spaces.

• Design007 Magazine — October 2021
• Feature Contents — Design Data Formats
• Additional Contents
• Flex007 Contents
• Column — Data Formats: Designers Like What They Like
• Feature Interview — The Case for Gerber: Interview with Karel Tavernier and Dirk Stans
• Short — Emergent Magnetic Monopoles Isolated Using Quantum-Annealing Computer
• Feature Interview — The Case for ODB++: Interview with Pat McGoff and Max Clark
• Feature Interview — The Case for IPC-2581: Interview with Ed Acheson
• Feature Article — IPC-2581: An Open, Neutral, Efficient Data Transfer Format
• Feature Column — Finding Value in Gerber Files
• Short — Hire or Be Hired at jobConnect007
• Column — The Impact of No-Clean Flux Residue on Signal Integrity
• PCB007 Highlights
• Feature Interview — Who Selects the Design Data Format, and Why?
• Short — New Tech Prevents Li-Ion Battery Fires
• Feature Article — Tribal knowledge and Design Data Formats
• Column Excerpt —Elementary, Mr. Watson: The Danger of Rogue Libraries
• Feature Interview — Sunstone Circuits: Use the Design Data Format That Gives You Best Results
• Column — Overview of Test Methods to Determine Material Dk and Df
• Feature Interview — Sunny Patel on Design Data Formats
• Column — Fake Fudged Facts—Using Software Tools to Get the Right High-speed Answer
• Column Excerpt: All Systems Go! Comprehensive Thermal Analysis of a System Design
• Column — Are Encapsulation Resins Suitable for EV Applications?
• Short — Excerpt: The System Designer's Guide to… System Analysis, Chapter 3
• Column — Electronics Data Format Collaboration— Help Wanted
• Column — It's Happening Everywhere—Be Ready
• MilAero007 Highlights
• Column — Additive Electronics—Are You One of the Curious?
• Short — 24 Essential Skills for Engineers: The Story Behind the Book
• Article — DFM 101: PCB Via Structures
• Flex007 Article — RealTime with… American Standard Circuits: Approaches to Flex and Rigid-Flex PCBs
• Flex007 Highlights
• Flex007 Column — Flexible Circuits—A Casalyst for Technological Evolution
• PCBDesign007 Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
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