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OCTOBER 2021 I DESIGN007 MAGAZINE 87 and thermal conductivity to remain as the solu- tions provider of choice for the ever-changing automotive industry. E-mobility is an evolving market, where the various performance criteria for vehicle com- ponents is constantly changing to keep up with the latest developments in technology. Encap- sulation resins capable of dissipating heat away from hard working components clearly add value to the automotive electronics industry. I hope this has been of interest to those of you involved in EVs and helps make life a bit easier for those who are responsible for making the decisions on protecting components and cir- cuitry. In my next column I will be exploring resin systems in more detail. DESIGN007 Beth Turner is head of encapsu- lation resins at Electrolube. To read past columns from Electro- lube, click here. Download your free copy of Electrolube's book, The Printed Circuit Assembler's Guide to… Conformal Coatings for Harsh Environments, and watch the micro webinar series "Coatings Uncoated!" management solution capable of aggregating data from the integrated circuit (IC) designer, the package designer, and the board designer, for system-level optimization and providing the top-level netlist for signoff connectivity verification. There is a need for methodologies and tools to handle the end-to-end flow from chip design to system analysis. To download this free I-007eBook, click here. To view the entire I-Connect007 library, click here. The rate of growth of transistors packed into an IC is slowing every year, marking the limits of physics. The economics of semiconductor logic scaling are also disappearing, and the cost per transistor has increased drastically. Advanced node chip design has become difficult, specialized, and expensive. SoCs are reaching the reticle limit. These limitations have made the industry look for alternatives beyond Moore's law. The volume of data being analyzed is increas- ing in complexity and has created the requirement for better design methodologies. New applica- tion-based architectures push the limits of current design tools, and the requirements for PPA targets are much more aggressive than before. Advanced- node processes provide designers the opportunity to improve performance, reduce power, and meet area requirements through new device and manu- facturing innovations. It's more than just doing syn- thesis and placing and routing better, instead it's a race to achieve computation excellence and high scalability. The cost of late market entry is another major challenge daunting the EDA industry. The tra- ditional tools are not capable of providing a single impulse response to accurately simulate the system before manufacturing. The transition from single monolithic to multi- chiplet architectures has introduced a plethora of issues to designers—like how to plan, manage, and optimize their top-level design and connectivity—and has led to the need for a new, system-level design Excerpt: The System Designer's Guide to… System Analysis Chapter 3: Limitations of Today's Electronic System Design

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