Issue link: https://iconnect007.uberflip.com/i/1419905
72 PCB007 MAGAZINE I OCTOBER 2021 significant added costs along with easier fabri- cation processes and higher electrical perfor- mance and reliability. e process and applica- tions already developed by NextGIn Technol- ogies are: VeCS -1, -2, and -HDI 2,3 . e three main combinations of their interconnect slot technology are defined as: • VeCS-1: Where the channel (slot) goes through the substrate • VeCS-2: Here, the slot is formed as blind or in a hybrid-blind and through-slot combination • VeCS-HDI: Laser-drilled microvias are used for fine-pitch utility on ultra-fine- pitch components Figure 2 highlights these three structures. With channels (slots) formed from both sides, the 3D vertical traces provide greatly increased density without sequential lamina- tions. Replacing larger through-hole vias with slots provides better power integrity for new power-hungry chips while lowering induc- tance and capacitance for improved signal integrity. The Channel or Slot e all-important step of metallizing and plating the typical 0.3 mm blind slot is shown in Figure 3. for various depths and lengths (from depths of 0.47 mm to 1.23 mm and lengths of 0.6 mm to 1.8 mm). Some of the smaller aspect ratios have insufficient chemical exchange but Figure 2: (Left) three different structures, based on the original concept of a slot or trench, make up VeCS; (right) trace routes showing various layers, and 3D views of the construction. (Source: NextGIn)