OCTOBER 2021 I PCB007 MAGAZINE 81
References
1. "Finstrate: A New Concept in IC Substrates,"
Steve Leishman, IPC Seminar on Competitive
Electronics Packaging, October 1983, Washington,
D.C.
2. "Vertical Conductive Structures—a New Dimen-
sion in High-Density Printed Circuit Interconnect,"
Pete Starkey, The PCB Magazine, February 2017,
pp. 16-20.
3. "Vertical Conductive Structures, Part 1: Rethink-
ing Sequential Lamination," Joan Tourné, PCB007
Magazine, April 2019, pp. 88-93.
4. "Vertical Conductive Structures, Part 2: VeCS
and Micro-machining," Joan Tourné, PCB007 Maga-
zine, June 2019, pp. 72-78.
5. "Vertical Conductive Structures, Part 3: Design
Tool Techniques," Joan Tourné, PCB007 Magazine,
August 2019, pp. 90–99.
6. "Vertical Conductive Structures, Part 4: Tuning
Your Signal Performance," Joan Tourné, PCB007
Magazine, October 2019, pp. 68–76.
7. Vertical Conductive Structures, Joan Tourné,
EIPC Winter Conference 2020 presentation.
8. "The Impact and Benefits of VeCS Technology,"
an interview with Joan Tourné and Joe Dickson,
PCB007 Magazine, November 2020, pp. 30-43.
9. VeCS-New High-Density Interconnects, Joe
Dickson, Linkedin, November 2020.
Happy Holden is an
I-Connect007 technical
editor, and the author of 24
Essential Skills for Engineers.
To read past columns, or
contact Holden, click here.
Figure 10: Routing of a very-fine pitch BGA using HDI, and VeCS-2 buried slots with close-up of
quarter-pattern. (Source: NextGIn Technologies)
From Happy Holden: 24 Essential Skills for Engineers
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uct and process life cycles, Lean manufacturing, and predictive engineering. You
won't find all this information in one publication anywhere else. Happy has done all
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