PCB007 Magazine

PCB007-Oct2021

Issue link: https://iconnect007.uberflip.com/i/1419905

Contents of this Issue

Navigation

Page 86 of 109

Conquer even the toughest requirements of the automotive industry with NEAP info @ atotech.com To find out more about NEAP, scan the QR-Code to the right. www.atotech.com NEAP is our new non-roughening adhesion promoter on silver surfaces of lead frames with alone-in- its-class performance. It helps you to dramatically increase performance and reliability under humidity and heat exposure of lead frame packages. Implementation is quick and hassle-free, and thanks to chemistry savings and drag-out reduction, you can lower expenses from the very start. Enjoy more ease of use and performance with this environmentally friendly solution. It's got all you need to reach your automotive OEM qualifications and more. A significantly higher thermal stability also helps you meet even the toughest requirements set by the automotive industry, even beyond MSL1.

Articles in this issue

Links on this page

Archives of this issue

view archives of PCB007 Magazine - PCB007-Oct2021