Issue link: https://iconnect007.uberflip.com/i/1426508
A-SAP ™ Averatek semi-additive process offers a 90% reduction in size and weight over current state-of-the-art with 15 micron (.6 mm) trace and space Smaller is better. More info on A-SAP™ www.averatek.com 19mm 6mm Typical capability in the USA today: 75 microns A-SAP™: 25 microns and below A-SAP ™ allows use of much smaller packages A-SAP ™ enables ultra-high electronics density