PCB007 Magazine

6 PCB007 MAGAZINE I NOVEMBER 2021 SHORTS I-Connect007 Launches Real Time with... American Standard Circuits Event Additive Reality: Drop Your (Solder) Mask, it's Sampling Time Keysight's Massively Parallel Board Test 'Thermal Switches' Dynamically Moderate Heat of Electronic Devices BYU Researchers Create World's Most Power-Efficient, High-Speed ADC Microchip DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead ARTICLE 2021 International Electronics Circuit Exhibition (Shenzhen) Coming December 8-10 by Tulip Gu COLUMNS Test and Measurement: Drawing Inspiration from IC Design by Nolan Johnson Better Electronics Start with Better Training by John Mitchell Induction Lamination by Happy Holden The Significance of IPC ENIG Specification 4552 Revision B by George Milad The New Electrical Test: Riding the Wave by Todd Kolmodin HIGHLIGHTS PCB007 Suppliers EIN007 Industry News MilAero007 Top 10 from PCB007 88 8 36 72 78 84 50 60 82 96 26 40 58 86 94 99 114 115 NOVEMBER 2021 • ADDITIONAL CONTENT 88

• PCB007 Magazine — November 2021
• Featured Content — Test and Inspection
• Additional Content
• Column — Test and Measurement: Drawing Inspiration from IC Design
• Feature Interview — Test and Inspection: Far Beyond Opens and Shorts
• Feature Interview — Fascinating Opportunities in Flying Probe Testing
• Short — I-Connect007 Launches Real Time with…American Standard Circuits Event
• Feature Interview — New Methods for Quantifying PCB Design Weaknesses and Manufacturing Challenges
• Column — Better Electronics Start with Better Training
• Short — Additive Reality: Drop Your (Solder) Mask, it's Sampling Time
• Feature Interview — Test and Inspection: Competitive Advantage and Cost of Doing Business
• Supplier Highlights
• Feature Article — Design to Production Flow: DFT and Test Coverage Using Industry 4.0 Principles to Produce Good Products
• Short — Keysight's Massively Parallel Board Test
• Electronics Industry News and Market Highlights
• Feature Interview — Alex Stepinski: A Philosophical View
• Column — Induction Lamination
• Column — The Significance of IPC ENIG Specification 4552 Revision B
• MilAero007 Highlights
• Column — The New Electrical Test: Riding the Wave
• Short — 'Thermal Switches' Dynamically Moderate Heat of Electronic Devices
• Article — 2021 International Electronics Circuit Exhibition (Shenzhen) Coming December 8-10
• Short — BYU Researchers Create World's Most Power-Efficient High-Speed ADC Microchip
• Top Ten Editor's Picks
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
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