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72 PCB007 MAGAZINE I NOVEMBER 2021 Multilayers have been around about as long as the printed circuit. e industry has always used heated hydraulic lamination presses to produce these multilayers, with the intro- duction of vacuum assist in the 1980s. But recently, with the encouragement of Green- Source Fabrication, induction lamination has been perfected by Chemplate Materials of Spain. Chemplate had introduced the use of induction-pinning by optical alignment of innerlayers for multilayer stackup in the early 2000s. is was to go with another innovative way to laminate innerlayers together—the Italian CEDAL resistance-foil vacuum-press, which had some early adopters. e induction vacuum lamination press (InduBond R X-Press) from Chemplate (Fig- ure 1) is a very compact machine. at stems from its innovative use of magnetic flux to induce heating in the stainless-steel caul plates of the multilayer stackup vs. electric, steam, or hot-oil heating of the press platens. Induction Lamination Happy's Tech Talk by Happy Holden, I-CONNECT007 Figure 1: New technology using magnetism to produce heat to laminate PCB materials in record time and with uniform temperatures. (Source: Chemplate 1 )

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