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NOVEMBER 2021 I PCB007 MAGAZINE 75 K-joules, nearly 18.5 times more energy. With two hot platens, more hot platens will increase the energy load. e heat transfer is so efficient and uniform that 30 multilayers can be applied to a single opening, vs. the need for multiple daylight openings with smaller stack in conventional lamination (Figure 4). Profile Programming e lamination press profile is normally composed of the combination of three dif- ferent profiles in a unique timeline: temper- ature, pressure, and vacuum (see controls in Figure 1). phy on one of the platens from conventional press technology, and another thermogra- phy of the new magnetic press technology (Figure 4). e le side shows the hot platen heat distribution where the platen surface and the sides are hot while the center (press stack) is cooler and needs more time to transfer the heat through the press stack mate- rials. e right side shows that platens are at almost ambient room temperature while the center of the press stack is hot and uniform in temperature. Energy Efficiency In the article by Gallego, he provides a detailed analysis of how the induction process requires lower energy, more uniformly dis- tributed and at a faster rate than does conven- tional press technology. A stackup mass of M 2 (4 kg) and M 3 (4 kg) heated from room temperature, 25°C (77°F) to 220°C (430°F) with induction energy requires only 702 K-joules, while a hot press with 70 kg plat- ens will require 12,987 Figure 4: The thermography comparison of traditional hot-platen lamination compared to cold-platen, electromagnetic lamination. (Source: Chemplate) Figure 3: The InduBond X-press schematic cross-section view with constructions. (Source: Chemplate)