Issue link: https://iconnect007.uberflip.com/i/1428512
92 PCB007 MAGAZINE I NOVEMBER 2021 technical hotspots in exhibitions and seminars worth mentioning, and what role will they play in promoting the development of PCB indus- try in the future? A: In the field of chip manufacturing, the changing packaging technology, and the more high-speed and high-frequency applica- tions brought by 5G era, have driven the car- rier industry to take off. With the theme of "5G Connecting the World," this exhibition brings together industry giants and start-ups to dis- play innovative equipment, technologies and solutions covering the whole supply chain of the circuit board and electronic assembly industry, to help the industry accelerate the integration and innovation with 5G and sus- tainable development. From the perspective of carrier classifica- tion, the technology used by flip chip BGA has had strong growth momentum in recent years. It can achieve narrow line width and line spac- ing, relatively more layers, and can support some high-order packaging. In addition, many module class carrier applications are related to mobile phones and consumer products. Espe- cially for 5G high-frequency transmission, it needs new modules. ese two types of carrier boards will be the focus of development in the next few years. e development of the carrier board industry will promote PCB industry to integrate into the whole semiconductor indus- try chain. Q: What is the global PCB development application fields and technical trends worthy of special attention in the industry? A: With the effectiveness of vaccination, herd immunity, and other measures, the global economy has gradually recovered in 2021. With the increase of industrial procurement, the global PCB industry will continue to grow. 2021 is also the opening year of China's "14th Five-Year Plan." e long-term goal of 2035 is to accelerate the promotion of digital industri- alization, cultivate and expand emerging dig- ital industries such as artificial intelligence, big data, blockchain, cloud computing and cybersecurity, etc., enhancing the industrial level of communication equipment, core elec- tronic components as well as key soware. It is aimed to build 5G-based application scenar- ios and industrial ecology by carrying out pilot demonstrations in key fields such as intelligent transportation, intelligent logistics, intelligent energy, and intelligent medical treatment. Under the environment of accelerating dig- ital industrialization, the electronics industry is facing different opportunities from the past.