Issue link: https://iconnect007.uberflip.com/i/1437606
52 PCB007 MAGAZINE I DECEMBER 2021 paper and presentation submissions. As of now, I will be chairing two sessions at the con- ference: Microvia Design and Test 1, and Sur- face Finishes and Coatings. I-Connect007: Tell us about your sessions. Why are these topics so important for today's fabri- cators? Czaplewski: e two technical sessions that I am chairing in the PCB Fabrication and Mate- rials track address topics of interest to PCB manufacturers and OEMs. Let me briefly explain them. Microvia Design and Test e densification of electronics has led to widespread use of high-density interconnect (HDI) PCBs with multiple layers of micro- vias. is increased usage has exposed a crit- ical microvia reliability concern: separation at the plating-to-target-pad interface, causing latent and intermittent opens. Ensuring multi- ple layers of microvias can withstand thermal and mechanical stresses of assembly and use is of utmost importance. is year, IPC APEX EXPO 2022 is offer- ing two technical sessions devoted to microvia design and reliability to highlight new findings Sarah Czaplewski Discusses the PCB Fab and Materials Track Feature Interview by the I-Connect007 Editorial Team You may remember Sarah Czaplewski, a senior reliability engineer at IBM who co- wrote the Best Technical Paper at the virtual IPC APEX EXPO last year. Sarah was also a member of IPC's Emerging Engineers pro- gram. is year, Sarah is the director of the PCB Fabrication and Materials track at IPC APEX EXPO 2022 in San Diego. We asked Sarah to discuss her role as track director, as well as the classes she's presenting at IPC APEX EXPO and the benefits of attending the conference portion of the show. I-Connect007: Sarah, tell us about yourself and your responsibilities as track director of the Fab and Materials curriculum. Sarah Czaplewski: I am a senior PCB reliability engineer at IBM, and I am serving as the PCB Fabrication and Materials track director for the IPC APEX EXPO 2022 Technical Program Committee. Along with a few others support- ing the PCB Fabrication and Materials track, I evaluate submitted abstracts, help organize accepted abstracts into sessions, and review Sarah Czaplewski