Issue link: https://iconnect007.uberflip.com/i/1440051
92 SMT007 MAGAZINE I JANUARY 2022 terfeits are in this class. e components are typically damaged considerably due to usage, aging, and the recycling process. Recycled components are usually manufac- tured by an original component manufacturer (OCM), and although they may utilize an older inner design, all evidence of the recycling pro- cess is on the components' exterior packaging as the inside of the component remains unscaled. Copies and Cloning Copies, cloning, or just simply fakes are com- ponents that are manufactured by a copy man- ufacturer and not by the original manufacturer. ey may be reverse-engineered components using fraudulent technology or IP. e unau- thorized manufacturer is attempting to dupli- cate the original design, process, and materi- als to obtain the same level of functionality as the original. However, in most cases the copy is inferior to the original in every aspect as the fraudulent manufacturer has no liability to the quality or performance of his products and no improvement by feedback can be achieved. In some cases, copies are manufactured under li- cense from the OCM, but they are marked and labeled accordingly. Copies or clones are different from the origi- nal in both the interior and the exterior as they are produced and packed at a different manu- facturing site. Overproduced Components Overproduced components are illegally man- ufactured by the contract foundry of the OCM. In some cases, the OCM is using the fabless mod- el by designing the IP and masks for their com- ponents and the fabrication foundry holds the knowledge of the fabrication process and has all the production masks. e contract foundry may overproduce parts by fabricating the yield data and then sell the extra chips to the market. Out-of-Spec Components Out-of-spec/defective components origi- nate from a criminal foundry which can sell de- fective parts that will most likely pass an initial screening as it is unlikely that the defect will ap- pear in the normal operation of the chip in the first few hours or months. Eventually, though, it will fail. Out-of-spec parts underperform the design specification (leakage current, dynamic current, performance, temperatures, etc.) Overproduced and out-of-spec/defective components are identical from the inside as they are manufactured by the same foundry us- ing the same process and materials. However, their exterior may be different from the origi- nal because the component packaging process is rarely performed by the same foundry. Fore-dated Components Fore-dated components are old compo- nents sold as new. ey may be made by the OCM, but their tracking information and la- bels are forged. Components are typical- ly good for the SMT process within 18–36 months of their production. Following that period their soldering leads may grow thick oxidation layers and their metallic formation may alter due to intermetallic reaction in the alloy on the leads. In some cases, the leads may be re-tinned to accommodate for the ex- pected low solderability. Fore-dated components may be almost iden- tical from the inside of the component, except for utilizing the older design. External evi- dence may be by older packaging techniques or by the condition of the leads. As seen in Table 1, all common counterfeit types leave vi- sual evidence on their external parts. In some cases, copies are manufactured under license from the OCM, but they are marked and labeled accordingly.