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98 SMT007 MAGAZINE I JANUARY 2022 package. is is because all common cases of fraud and bad handling leave evidence on the exterior of the component package. A method to utilize images of components taken during assembly by the pick-and-place camera already installed on the SMT machine or by a reel-to-reel inspection machine is present- ed. e method employs image processing and deep learning networks to classify the source of the components based on big data comprising over 0.5 billion components and growing at a rate of over 30 million components a day. A method to further estimate the apparent age of the soldering leads of the components as a part of a component qualification algorithm is presented. is novel method assuring the quality of electronic products by inspecting 100% of the electronic components is presented. Assuring the quality and authenticity of all assembled components will have a huge impact on elec- tronics quality. SMT007 References 1. "Electronic component solderability assess- ment algorithm by deep external visual inspection," by E. Weiss, 2020 IEEE Physical Assurance and In- spection of Electronics (PAINE), Washington, DC, USA, 2020. 2. "Supply Chain Optimization to Mitigate Elec- tronic Components Shortage in Manufacturing of Telecommunications Network Equipment," by A. Mi- galska and W. Pawlus, 2020 IEEE 29th International Symposium on Industrial Electronics (ISIE) (pp. 474- 479). IEEE. 3. "Combined effects of surface oxidation and in- terfacial intermetallic compound growth on solder- ability degradation of electrodeposited tin thin films on copper substrate due to isothermal ageing," by J. Wang, G. Chen, F. Sun, Z. Zhou, Z.-Q. Liu, and C. Liu Corros, Sci., vol. 139, pp. 383–394, 2018. 4. "An overview of non-destructive testing meth- ods for integrated circuit packaging inspection," by P. Aryan, S. Sampath, and H. Sohn Sensors (Switzer- land), vol. 18, no. 7, 2018. 5. "System and Method for Detection Of Counter- feit and Cyber Electronic Components," by E. Weiss, P-594746, 2019. 6. "System and Method for Nondestructive As- sessing of Solderability of Electronic Components," P-603537, by Eyal Weiss, 2021. 7. "A review of lead-free solders for electronics ap- plications," by S. Cheng, C.-M. Huang, and M. Pecht, Microelectron. Reliab., vol. 75, pp. 77– 95, 2017. 8. "Method 208, Solderability," by S. E. Harpe, et al, MIL-STD, no. 2, 2015. 9. "Quantified fault tree techniques for calculating hardware fault metrics according to ISO 26262," by N. Das and W. Taylor, 2016 IEEE Symposium on Prod- uct Compliance Engineering (ISPCE), 2016, pp. 1–8. 10. "Advanced manufacturing Technology: A Sol- derability Inspection System," by J.R. Villalobos-ca- no and W. C. Johnson, February 1991, pp. 144–149, 1992. 11. "Optical Inspection for Soldering Fault Detec- tion in a PCB Assembly using Convolutional Neural Networks," by M. B. Akhtar, 2019. 12. "Machine learning framework for predicting reliability of solder joints," by S. Yi and R. Jones, Sol- dering & Surface Mount Technology, 2019. 13. "Moisture diffusion and vapour pressure mod- eling of IC packaging," by E. H. Wong, Y. C. Teo, and T. B. Lim, 1998 Proceedings, 48th Electronic Com- ponents and Technology Conference, 1998, pp. 1372–1378. 14. "Moisture absorption and mechanical perfor- mance of surface mountable plastic packages," by B. K. Bhattacharyya, W. A. Huffman, W. E. Jahsman, and B. Natarajan, 38th Electronics Components Conference 1988., Proceedings, 1988, pp. 49–58. 15. "FEA simulation on moisture absorption in PBGA packages under various moisture pre-con- ditioning," by L. T. Fai, in 2000 Proceedings, 50th Electronic Components and Technology Confer- ence, 2000, pp. 1078–1082. 16. "Moisture absorption and diffusion character- ization of molding compound," by X. Chen, S. Zhao, and L. Zhai, 2005. Eyal Weiss, Ph.D., is CTO and founder of Cybord.