Design007 Magazine

6 DESIGN007 MAGAZINE I JANUARY 2022 SHORTS All Systems Go! Meet Power Delivery Requirements Upfront With Power-First PCB Implementation BYU Researchers Can 3D Print Microfluidic Devices With Components Smaller Than Ever Before DEPARTMENTS Career Opportunities Educational Resource Center Advertiser Index & Masthead COLUMNS High-Voltage PCB Design: Don't Let the Smoke Out by Andy Shaughnessy Design for Test, Part 1 by Vern Solberg Semi-Additive Process: Evaluating from a Design Perspective by Tara Dunn Seamless Hand-off From Design to Manufacturing by Patrick McGoff Top Design Tips for a Successful Coating Process by Phil Kinner Everything You Wanted to Know About Electromagnetic Interference by Matt Stevenson Next-Generation Engineers Need Next-Generation Training by Mike Buetow HIGHLIGHTS PCB007 MilAero007 Top Ten Editor's Picks 26 48 115 130 131 10 32 78 82 88 92 94 66 86 112 JANUARY 2022 • ADDITIONAL CONTENTS 62 68 62 68 98 INTERVIEWS & ARTICLES IPC APEX EXPO 2022: Focus on PCB Design Interview with Patrick Crawford Living in a Material World: High-Speed Design Strategies Interview with Lee Ritchey and Tarun Amla DFM 101: Signal Layers by Anaya Vardya

• Design007 Magazine — January 2022
• Feature Contents — High-Voltage PCB Design
• Additional Contents
• Flex007 Contents
• Column — High-Voltage PCB Design: Don't Let the Smoke Out
• Feature Interview — High-Voltage PCB Design: Beating Separation Anxiety
• Feature Article — High-Voltage Circuit Design Guidelines and Materials
• Short — All Systems Go!: Meet Power Delivery Requirements Upfront with Power-First PCB Implementation
• Feature Column — High Voltage PCB Constraints
• Column — Design for Test, Part 1
• Feature Article — Automotive Electrification
• Feature Column — The Misadventures of High Voltage and Other Power Problems
• Feature Article — A High-Voltage PCB Design Primer
• Short — BYU Researchers Can 3D Print Microfluidic Devices With Components Smaller Than Ever Before
• Feature Column — Mitigating Potential for High-Voltage Injury
• Feature Column — Uncompensated DC Drop in Power Distribution Networks
• Interview — IPC APEX EXPO 2022: Focus on PCB Design
• PCB007 Highlights
• Interview — Living in a Material World: High-Speed Design Strategies
• Column — Semi-Additive Process: Evaluating from a Design Perspective
• Column — Seamless Hand-off From Design to Manufacturing
• MilAero007 Highlights
• Column — Top Design Tips for a Successful Coating Process
• Column — Everything You Wanted to Know About Electromagnetic Interference
• Column — Next-Generation Engineers Need Next-Generation Training
• Article — DFM 101: Signal Layers
• Flex007 Feature Interview — Testing Flexible Circuit Assemblies
• Flex007 Highlights
• Flex007 Feature — Calling Out Materials for Flex Circuits and Getting it Right
• Flex007 Short — Soft Semiconductors That Stretch Like Human Skin Can Detect Ultra-low Light Levels
• Top Ten Editor's Picks
• Career Opportunities Section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Problems Solved! Subscribe to our magazines.