PCB007 Magazine

PCB007-Jan2022

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64 PCB007 MAGAZINE I JANUARY 2022 ere are also applications in the semicon- ductor packaging segment, where we are working with some of the leading OSATs. Beaulieu: Will you explain more about CLAD? Birnbaum: It is a proprietary technology we developed for additive manufacturing based on the laser induced forward transfer (LIFT) technology. A material, evenly coated on a transparent carrier film, passes under a laser. e laser applies a short burst of energy to it. is releases perfectly consistent drops of material onto the substrate below. e mate- rial drops can then be sintered or cured inline within the same machine. A great benefit is that this technology works for solder and poly- mers as well as for metals and ceramics. Up to six materials can be printed at the same time. Beaulieu: Can you dig down a little deeper on what the product does? Birnbaum: Sure. Any surface where you want to deposit one material onto another can find benefits with this technology. All along the electronics supply chain, whether it is creating an entire multi-layer HDI PCB, copper traces and filling vias, or only the solder mask, depos- iting the solder paste, replacing the wire bond- ing, printing gaskets and conformal coating, or conductive adhesives for die bonding, CLAD technology can address it. We will be rolling out one application at a time, starting with sol- der paste balls, and solder mask, but we can currently print fine copper traces and perfectly fill vias without bubbles. Beaulieu: What do you feel sets it apart? Birnbaum: CLAD combines the benefits of multiple technologies, going beyond the limits of what is possible today. How do we compare with current technologies? Versus dispens- ing and aerosol, our technology offers much greater speed. Compared to screen print- ing, we bring digital design flexibility both in geometry and in co-planarity. Versus lithogra- phy, our process is much simpler and greener. Compared to inkjet, we go beyond prototyp- ing and offer a production system that is com- patible with industry standard materials. Beaulieu: Who will this product benefit? Who are your potential partner customers? Birnbaum: Leading innovators who face chal- lenges associated with production of new Figure 2: Pulse-laser jetting onto the substrate.

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