Issue link: https://iconnect007.uberflip.com/i/1447212
100 SMT007 MAGAZINE I FEBRUARY 2022 Career Opportunities Essential Responsibilities Qualified candidates must be able to orga- nize their own functions to match the goals of the company. Responsible for: • panel preparation, dry film lamination, exposure, development and the processes, equipment setup and maintenance programs • automated (PAL line) electrolytic copper plating process and the equipment setup and maintenance programs • both the cupric (acid) etching and the ammoniacal (alkaline) etching processes and the equipment setups and maintenance programs Ability to: • perform basic lab analysis and trouble- shooting as required • use measurement and analytical equipment as necessary • work alongside managers, department supervisors and operators to cooperatively resolve issues • effectively problem-solve • manage multiple projects concurrently • read and speak English • communicate effectively/interface at every level of the organization Organizational Relationships Reports to the Technical Director. Qualifications Degree in Engineering (BChE or I.E. preferred). Equivalent work experience considered. High school diploma required. Literate and functional with most common business software systems MS Office, Excel, Word, PowerPoint are required. Microsoft Access and basics of statistics and SPC a plus. Physical Demands Exertion of up to 50 lbs. of force occasion- ally may be required. Good manual dexterity for the use of common office equipment and hand tools. • Ability to stand for long periods. Work Environment This position is in a manufacturing setting with exposure to noise, dirt, and chemicals. Click on 'apply now' buttton below to send in your application. Wet Process Engineer ASC, the largest independent PCB manufacturer in the Midwest, is looking to expand our manufac- turing controls and capabilities within our Process Engineering department. The person selected will be responsible for the process design, setup, operating parameters, and maintenance of three key areas—imaging, plating, etching--within the facility. This is an engineering function. No management of personnel required.