56 PCB007 MAGAZINE I FEBRUARY 2022
thinning is that one has excellent adhesion of
the copper to the C-stage laminate.
A version of the process is shown in Table 3.
Emerging Technologies
ere are several new processes gaining
interest for HDI and ultra HDI. ese include
SAP type processes using liquid metal inks and
other types of seed layer for enabling of metal-
ization of the substrates, with the ultimate goal
of achieving sub 1 mil lines and spaces.
In a future column, I will present additional
insight into these newer processes along
with the advantages for the printed circuit
designer.
PCB007
Michael Carano is VP of technol-
ogy and business development
for RBP Chemical Technology.
To read past columns or contact
Carano, click here.
.
