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124 PCB007 MAGAZINE I FEBRUARY 2022 Career Opportunities Siemens EDA Sr. Applications Engineer Support consultative sales efforts at world's leading semiconductor and electronic equip- ment manufacturers. You will be responsi- ble for securing EM Analysis & Simulation tech- nical wins with the industry-leading HyperLynx Analysis product family as part of the Xpedition Enterprise design flow. Will deliver technical presentations, conduct product demonstrations and benchmarks, and participate in the development of account sales strategies leading to market share gains. • PCB design competency required • BEE, MSEE preferred • Prior experience with Signal Integrity, Power Integrity, EM & SPICE circuit analysis tools • Experience with HyperLynx, Ansys, Keysight and/or Sigrity • A minimum of 5 years' hands-on experience with EM Analysis & Simulation, printed circuit board design, engineering technology or similar field • Moderate domestic travel required • Possess passion to learn and perform at the cutting edge of technology • Desire to broaden exposure to the business aspects of the technical design world • Possess a demonstrated ability to build strong rapport and credibility with customer organizations while maintaining an internal network of contacts • Enjoy contributing to the success of a phenomenal team **Qualified applicants will not require employer- sponsored work authorization now or in the future for employment in the United States. Qualified Ap- plicants must be legally authorized for employ- ment in the United States. Arlon EMD, located in Rancho Cucamonga, California, is currently interviewing candidates for open positions in: • Engineering • Quality • Various Manufacturing All interested candidates should contact Ar- lon's HR department at 909-987-9533 or email resumes to careers.ranch@arlonemd.com. Arlon is a major manufacturer of specialty high-performance laminate and prepreg mate- rials for use in a wide variety of printed circuit board applications. Arlon specializes in thermo- set resin technology, including polyimide, high Tg multifunctional epoxy, and low loss thermo- set laminate and prepreg systems. These resin systems are available on a variety of substrates, including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCBs (i.e. in mobile communica- tion products). Our facility employs state of the art produc- tion equipment engineered to provide cost-ef- fective and flexible manufacturing capacity al- lowing us to respond quickly to customer re- quirements while meeting the most stringent quality and tolerance demands. Our manufac- turing site is ISO 9001: 2015 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our cus- tomers' requirements. For additional information please visit our website at www.arlonemd.com