Issue link: https://iconnect007.uberflip.com/i/1453746
32 PCB007 MAGAZINE I FEBRUARY 2022 tronic interconnect manufac- turer in the U.S. can only go so small with traditional subtrac- tive manufacturing processes. Another piece of this push toward additive technol- ogy is environmental. ere will be many more conversa- tions about the environmen- tal impact of manufacturing processes, and these consider- ations will factor more heav- ily into contract awards. With traditional subtractive pro- cesses you're removing cop- per, but with additive pro- cesses you're mostly adding copper. I believe there's going to be a shi in design to reduce waste streams regardless of technology, as part of the wider ESG movement. Brassard: Yes, ESG: environmental and social governance. Matties: Is that becoming more prevalent? LaBeau: We are just starting to see environ- mental considerations seep into conversations and design considerations at our level. Brassard: We are seeing more environmental considerations flowing down from the DoD. e DoD wants to see transition to greener solutions. Calumet is learning the ropes of fed- eral funding and we believe environmental considerations must be included in any sub- mitted proposal. We've been seeing these types of requirements added to RFPs in the last few years. Personally, I believe this is a good thing. We should be paying attention to what we are doing to the planet; this is just common sense. LaBeau: e additive and semi-additive movements are not just about miniaturiza- tion, but also system performance and integ- rity. Additive and semi-additive technolo- gies provide for better cop- per trace and feature forma- tion which improves signal integrity and shortens trans- mission lines, allowing faster bit rates and higher frequen- cies. For example, radar and communications systems achieve higher performance when trace walls are square and smooth. Combine the potential for feature forma- tion with advanced materi- als and chemical processes and a wide array of possibil- ities emerge. As an example, Calumet can plate copper on transparent sub- strates; just imagine the applications, for exam- ple, in the augmented reality space. Brassard: Barry, you asked if the industry will be required to move to additive technologies. is really depends on whether the U.S. elec- tronics manufacturing industry hopes to com- pete with Asia any time soon. Not with capac- ity—that ship has already sailed—but with capability and technology. If smaller elec- tronics enables more powerful electronic sys- tems, then Asia is clearly in the lead with their semi-additive and build-up technologies. Asia's manufacturing capability simply out- classes U.S. capability in every way that mat- ters. Where most U.S. PCB manufacturers hit the wall at 75-micron traces, Asian manufac- turers are routinely running at 18 and pushing down to 8-micron features. Your question res- onates at two immensely different scales; first, the domestic industry, and second in consider- ation of the individual PCB shop. Lawmakers are putting a tremendous amount of time, energy, and funding into increasing the U.S. capability to manufacture chips. Applause and well done, but this only solves part of the problem. Until we can pro- duce not only the chips, but also the electronic interconnects to wire the chips into systems, Todd Brassard