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FEBRUARY 2022 I PCB007 MAGAZINE 61 Embedded Multi-Die Interconnect Bridge A third architecture has emerged with Intel's proposal of using small silicon bridges (called EMIB) embedded in the substrate to provide the interconnect density of interposers while using the lower costs of package substrates (Figure 5). Table 1 and Figure 6 compare the advantages and disadvantages of the three HI packages. Table 2 and Figure 7 compare the materi- als frequency performance. Glass used in LCD displays is considered a main candidate to replace silicon. Figure 4: Silicon interposers have the advantage of CTE and density but with a higher cost for the TSVs. (Source: HIR Roadmap 6 ) Figure 5: The silicon embedded multi-die interconnect bridge (EMIB) provides traditional multi-chip package substrate with the die-to-die density of expensive silicon interposers. (Source: HIR Roadmap, version 2020, p. 10, Intel 7 ) Figure 6: Five characteristics of the three HI packaging alternatives. (Source: HIR Roadmap 6 )