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118 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE and tips for both CMMC and general cyberse- curity preparedness, touching upon require- ments like the 320 assessment objectives which apply to CUI assets as well as security assets. While there is no turnkey solution, Bonner advised being content with kickstarting new process areas and building into them, as the substantial price tag and 12–18-month time- line can be daunting. Bonner highlighted that the challenge isn't implementing the technol- ogy but rather the procedures and documenta- tion. e IPC Trusted Supplier Program was also mentioned as a resource. Manufacturing Technology and Business Tools Best Practices Highlighted e EMS Steering Committee is continually searching for industry peers who have unique or proven approaches to solving process or business challenges. is year, the group wel- comed quoting soware users Deb Gude of Spartronics and Charles Capers of Zentech to share their direct experiences with multiple tools. Additionally, former EMS peer, Robert Toppel of e1ectr0n, outlined robotic automa- tion best practices for low- to medium-volume electronics manufacturing. More EMS/Contract Manufacturer Content Planned To keep the industry up to date, build on dis- cussions, and address timely issues, the EMS Council is planning updates throughout the year. To stay informed of IPC EMS Council content and updates, contact Kelly Lawrence, IPC member success advocate. S&T Tracy Riggan is IPC senior director, business devel- opment, solutions. Presenter: Jasbir Bath, Support Advisory Engineer, Koki Solder America What is the most interesting question that your IPC APEX EXPO presenta- tion answers? The most interesting question the presentation answers is thermal cycling assessment of lead- free solder joints with an increased temperature limit of +150°C. Data at this higher temperature limit is limited in the industry with a need for data in this area based on increased product temperatures in the field. What is your answer to that question, and why? Results showed that the high-reliability lead-free solder alloy Sn3.5Ag0.5Bi6In0.8Cu (SABIX) had better thermal cycling reli- ability during -40°C to +150°C temper- ature cycling compared with lead-free Sn3Ag0.5Cu alloy. This was due to the elemental additions in the developed alloy helping to provide ductility in the solder joint as well as a strengthening effect. What is the most important piece of advice that you have for your audience? You need to fully evaluate your material choices when assessing the reliability of your products, especially for high reli- ability applications, to help avoid product issues in the field. IPC APEX EXPO: Conference Speakers Speak Out High-Temperature Thermal Cycling Reliability Testing of a High-Reliability Lead-free Solder Alloy

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