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74 I-CONNECT007 I REAL TIME WITH... IPC APEX EXPO 2022 SHOW & TELL MAGAZINE Bev Christian is a facilitator for the High Density Packaging User Group (HDPUG) and an adjunct associate professor in the Depart- ment of Mechanical and Mechatronics Engi- neering of the University of Waterloo, Water- loo, Ontario, Canada. In the past 31 years he has held positions at Nortel, BlackBerry, and CALCE; all in the areas of materials and failure analysis. Bev has never missed an IPC APEX EXPO since its inception. He is a member of 27 IPC committees and attends as time and the lack of clones allow. He has been the chair of the 5-32E Conductive Anodic Filament and 5-32D Electrochemical Migration task groups and is now the chair of 3-11G Corrosion of Metal Finishes and 5-24B Solder Paste task groups. Bev has helped author more than 50 published papers and has presented 23 of them at IPC events. Bev met his wife at the 1999 IPC Printed Circuits Expo. Bev Christian, HDPUG IPC's Dieter Bergman Fellowship Awards The Dieter Bergman IPC Fellowship Award is given to individuals who have fostered a collabora- tive spirit, made significant contributions to standards development, and have consistently demon- strated a commitment to global standardization efforts and the electronics industry. Each recipient will be eligible to bestow the Dieter Bergman Memorial Scholarship upon the university or college of his/her choice. Interviews by Patty Goldman I-CONNECT007

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