SMT007 Magazine
SMT007-Mar2022
Issue link:
https://iconnect007.uberflip.com/i/1456062
Contents of this Issue
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Articles in this issue
SMT007 Magazine — March 2022
Featured Content — State of the Industry
Additional Content
Column — The Legislative Chokepoint
Special Section: IPC Semiconductor Packaging Gap Analysis Report
Feature Interview — A Hard Look at Strategic Chip Investment
Feature Article — More Than a Supply Chain Problem
Feature Interview — Lean on Me: A U.S.-Europe Partnership
Electronics Industry News and Market Highlights
Feature Article — It's Time for Government to Step Up to the Plate
Video — Real Time with… IPC: A Global Collaboration
Interview — Dave Hillman on Living Your Passion
Video — Real Time with… IPC: Advanced Packaging Report
MilAero007 Highlights
New Column — Our Introduction to the Electronics Industry
Feature Interview — M&A Activity: Keep Your Eye on the Ball
Video — Real Time with… IPC: Update From PCBAA
Feature Column — What Happens in Washington Happens to Us All
Supplier Highlights
Article — How to Minimize Quote Time and Increase Accuracy in EMS Production
Article — Where Have All the Board Shops Gone?
Column — Solder Mask Repair Techniques for PCB Repair
Column — CFX IIoT Open-Source Hardware
Video — Real Time with… IPC: Advocacy in Washington
Column — A Tale of Two Perspectives
Top Ten Editor's Picks
Career Opportunities Section
I-007e Educational Resource Center
Advertiser Index and Masthead
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