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MARCH 2022 I SMT007 MAGAZINE 15 4 November 2021 SEMICONDUCTOR SUPPLY BASE The semiconductor ecosystem is bult upon a robust mix of local, regional, and global suppliers. Next- generation package designs and architectures are made possible by continuous improvements in base materials, manufacturing equipment, and process advancements that span all sectors of the supply chain. Addressing all these areas is necessary if the goal is to achieve a sustainable and resilient North American semiconductor ecosystem. IPC's advanced packaging full report discusses the need for strong materials, design, and equipment supply chain that underpins the supply base. GLOBAL SEMICONDUCTOR INDUSTRIAL ASSESSMENT Companies headquartered in Asia are global leaders across the entire semiconductor supply chain, with the top companies dominating market share in semiconductor fabrication (TSMC, Samsung); advanced IC-substrate fabrication (Unimicron, Ibiden, SEMCO, Nan Ya, Shinko); and OSAT assembly and test, (in which Taiwan is the leader with nine companies including ASE+SPIL and Powertech Technology). North America lags behind Asia in capacity, but technical capability is a source of concern as well. Asian manufacturers also dominate the printed circuit board (PCB) and electronic manufacturing services (EMS/ODM) sectors, where outsourcing and off-shoring have been prevalent over the past 20 years. Asia's dominance in electronics arises from the region's breadth of manufacturing capabilities from chips through advanced packaging through PCB fabrication and final hardware / system assembly capability. GLOBAL SHARE 85% Semiconductor Design 5% 12% Manufacturing 75% 3% Packaging 97% North American electronics manufacturing capabilities. Source: U.S. Department of Defense