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© 2022 MacDermid, Inc. and its group of companies. All rights reserved. "(R)" and "TM" are registered trademarks or trademarks of MacDermid, Inc. and its group of companies in the United States and/or other countries. ELECTROLYTIC COPPER Production-proven Processes A full portfolio of acid copper products that meet all applications, from ultra aspect ratio conformal plating down to filling the smallest blind microvias. Copper via fill Electrolytic Copper Through Hole Plating Electrolytic Copper Through Hole Filling MacuSpec™ VF Series – General via filling in panel or pattern plating mode MacuSpec™ AVF Series – Advanced via filling for Any Layer applications MacuSpec™ VF-TH Series – For combined through hole plating and via filling in high density additive processing MacuSpec™ HT Series – High throwing power DC baths with with pulse-like plating performance MacuSpec™ PPR Series – Pulse plating baths with superior microdistribution with wide operating windows Systek™ THF Series– Solid copper through hole filling processes for applications ranging from SL-PCB to package substrate Flat surface profile for excellent compatibility with subsequent build-up steps Cavity-free filling on a wide range of through hole dimensions and board types