98 PCB007 MAGAZINE I MARCH 2022
The photoimaging process is
one of the first steps in the
PCB fabrication process.
In order to ensure that
the image of the circuitry
conforms as close to the desired
design as possible (i.e., lines and spaces),
surface preparation of the copper foil surface
is one of the most critical success factors.
Employing the optimum mix of surface cleaners
and microetchants will provide a clean surface
with sufficient surface area to promote dry film
adhesion.
John W. Mitchell, president and CEO of IPC, shares
his thoughts with Barry Matties about the return of
the in-person IPC APEX EXPO after a two-year
hiatus. Hint: He was very positive about it.
Pete Starkey interviews Mark Goodwin,
COO of Ventec International, on the
impact of the current supply chain
condition. Their conversation also
covers aerospace and the U.S. market.
Real Time with... IPC APEX EXPO:
Update From PCBAA
PCBAA Chairman Travis Kelly sits down with Nolan
Johnson to discuss the new association's recent
activities and future plans. The Printed Circuit Board
Association of America is focused on advocating
for manufacturing in America.
Trouble in Your Tank: Surface
Preparation—The Foundation of
the Photoresist Imaging Process
Real Time with... IPC APEX EXPO:
John Mitchell Shares Thoughts
on the Show
Real Time with… IPC APEX
EXPO 2022: The Supply
Chain and Markets
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