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88 PCB007 MAGAZINE I APRIL 2022 tests were performed according to USCAR 2 revision 6 specification. 3 e results show that the ASEP microPDB can carry 50 amps of current at 110°C ambi- ent. e package shuts down at higher cur- rents as the temperature rises more than 55°C above ambient. In addition to a thermal test, the ASEP assembly met all the requirements of the vibration and thermal shock tests. Table 1 provides a comparison between the size and weight of a PCB microPDB design cur- rently in production and the ASEP microPDB design. e ASEP microPDB is 58% smaller and 22% lighter with an improved current capability at higher temperatures. Conclusion ASEP is a design and manufacturing pro- cess that allows the industry to take advantage of the latest injection moldable plastics along with the proven ability of conduc- tive metal frames to remove heat, carry high currents, and to provide reliable elec- trical interconnects. e technology is ideal for a modular approach to control in electric vehicles where the control is distributed by its net- work but there is a need for high current or high voltage while providing cooling for a long-lived, reliable system control. PCB007 References 1. "Progress in digital integrated electronics," by G.E. Moore, Digest of the 1975 International Elec- tron Devices Meeting, pp. 11–13. Washington, D.C. 2. "ASEP (Application Specific Electronics Pack- age), a Next Generation Electronics Manufacturing Technology," by Victor Zaderej and Richard Fitztpatrick, Molex; Babak Afraei, Ford Motor Co., Proceedings of SMTA Intn'l, 2018, Rosemont, Illinois. 3. Performance Specification for Automotive Elec- trical Connector Systems, USCAR-2 revision 6. Happy Holden has worked in printed circuit technology since 1970 with Hewlett-Pack- ard, NanYa Westwood, Merix, Foxconn, and Gentex. He is cur- rently a contributing technical editor with I-Connect007, and the author of Automation and Advanced Proce- dures in PCB Fabrication, and 24 Essential Skills for Engineers. To read past columns or contact Holden, click here.