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MAY 2022 I DESIGN007 MAGAZINE 107 Career Opportunities CAD/CAM Engineer Summary of Functions The CAD/CAM engineer is responsible for reviewing cus- tomer supplied data and drawings, performing design rule checks and creating manufacturing data, programs, and tools required for the manufacture of PCB. Essential Duties and Responsibilities • Import customer data into various CAM systems. • Perform design rule checks and edit data to comply with manufacturing guidelines. • Create array configurations, route, and test programs, panalization and output data for production use. • Work with process engineers to evaluate and provide strategy for advanced processing as needed. • Itemize and correspond to design issues with customers. • Other duties as assigned. Organizational Relationship Reports to the engineering manager. Coordinates activi- ties with all departments, especially manufacturing. Qualifications • A college degree or 5 years' experience is required. Good communication skills and the ability to work well with people is essential. • Printed circuit board manufacturing knowledge. • Experience using CAM tooling software, Orbotech GenFlex®. Physical Demands Ability to communicate verbally with management and coworkers is crucial. Regular use of the telephone and e-mail for communication is essential. Sitting for extended periods is common. Hearing and vision within normal ranges is help- ful for normal conversations, to receive ordinary information and to prepare documents. Arlon EMD, located in Rancho Cucamonga, California, is currently interviewing candidates for open positions in: • Engineering • Quality • Various Manufacturing All interested candidates should contact Arlon's HR department at 909-987-9533 or email resumes to careers.ranch@arlonemd. com. Arlon is a major manufacturer of specialty high-performance laminate and prepreg mate- rials for use in a wide variety of printed circuit board applications. Arlon specializes in thermo- set resin technology, including polyimide, high Tg multifunctional epoxy, and low loss thermo- set laminate and prepreg systems. These resin systems are available on a variety of substrates, including woven glass and non-woven aramid. Typical applications for these materials include advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and microvia PCBs (i.e. in mobile communica- tion products). Our facility employs state of the art produc- tion equipment engineered to provide cost- effective and flexible manufacturing capacity allowing us to respond quickly to customer requirements while meeting the most stringent quality and tolerance demands. Our manufac- turing site is ISO 9001: 2015 registered, and through rigorous quality control practices and commitment to continual improvement, we are dedicated to meeting and exceeding our cus- tomers' requirements. For additional information please visit our website at

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