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MAY 2022 I DESIGN007 MAGAZINE 39 David Wiens is Xpedition product manager for Siemens Digital Industries Software. To read past columns or contact Wiens, click here. Additional content from Siemens Digital Industries Software: The Printed Circuit Assembler's Guide to ...Smart Data: Using Data to Improve Manufacturing The Printed Circuit Assembler's Guide to… Advanced Manufacturing in the Digital Age Siemens' free, 12-part, on-demand webinar series "Implementing Digital Twin Best Practices From Design Through Manufacturing." RealTime With ... Siemens and Computrol: Achieving Operational Excellence in Electronics Manufacturing optimization. If you co-design the PCB, pack- age, and die, pre-optimization enables ideal, easy-to-implement routing. Co-design pro- vides design flexibility in all three domains, as the design of the target PCB, package, and die pads all begin at the same time. System-level optimization isn't just about simplifying the life of the poor PCB engineer, who is oen on the receiving end of a complex new 2.5/3D IC. A streamlined co-design meth- odology that seamlessly interchanges digital twins of ICs, packages and boards optimizes collaboration and minimizes rework. Attack- ing the full system problem at one time, rather than in discrete and serial chunks, enables per- formance optimization and cost reduction at each substrate level. DESIGN007 By Nitin Bhagwath, Cadence In an ideal world, when develop- ing a printed circuit board (PCB) for an electronic product, decisions made during the design process should drive the bill of materials (BOM). We may think of this as an example of "the dog wagging the tail." In the real world, however, there has always been some small amount of the BOM driving the design, which we may think of as "the tail wagging the dog." A clas- sic example of this is when an engineer's calcula- tions indicate the need for a resistor of 123 kΩ—a 40-cent part—while a 120 kΩ resistor—available for only 4 cents—will provide an almost identical response. Current realities have made such BOM-driving- the-design decisions more inescapable to ensure product manufacturability. Everyone around the globe—from small companies to mega-enterprises with trillion-dollar valuations, all the way to the U.S. government—is currently facing unprecedented supply chain challenges. Supply chain optimization has long been under pressure, involving as it does a sophis- ticated balance of low cost, future availability, and product needs. While it's true that dif- ficulty obtaining all the compo- nents that are perfect for the task at hand is not totally unprec- edented, alternative parts used to be plentiful. This meant that, even if you couldn't get exactly what you wanted, you could get something similar. But with sup- ply chain disruptions around the globe, even next-best parts are hard to find, mak- ing it critical to ensure component availability for the design. One part of the solution is for everyone in the organization to have visibility with respect to stock levels. It's important for this visibility to commence at the earliest stages of the design while the engi- neers are working on the initial high-level block diagram, thereby allowing for the design architec- ture to accommodate parts that can actually be sourced. To read the entire column, click here. COLUMN EXCERPT: All Systems Go! Supply Chain Woes: Which Comes First, the Design or the BOM?

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