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88 DESIGN007 MAGAZINE I MAY 2022 Multek to Reduce Carbon Emissions by Half by 2030 E Multek will work to reduce its carbon emis- sions by half by 2030 and continue to acceler- ate toward carbon neutrality. Altix Receives Bundle Machine Order from Major Chinese FPC & PCB Player E Altix is delighted to announce a significant order for both direct imaging and contact printer equipment. e bundle encompasses both panel and RtR solutions to be installed at a new plant in Jiangxi province. FLEX Conference 2022 to Highlight Latest Flexible Hybrid Electronics Innovations E FLEX Conference will gather industry experts July 11-14, 2022, at the Moscone Center in San Francisco for keynotes, panel discussions, technical sessions, and product-based demon- strations highlighting the latest innovations in flexible and printed electronics. Catching Up With Alpha Circuit's Prashant Patel E ere is plenty of evidence that the American PCB industry is going through a revitaliza- tion. While a few new companies are being established, others are being rejuvenated as investors gain more interest and confidence in domestic PCB companies. I reached out to Prashant Patel, owner and president of Alpha Circuit Corporation in the greater Chi- cago area. I wanted to hear about his invest- ment and the unique path he took to owning a PCB shop. S & P Flex Circuits Ltd Opts for Kaima Universal Fixture Tester From Gardien E Gardien Group is pleased to announce the installation of the Kaima bare circuit board fixture tester to S & P Flex in Scarborough, Ontario, Canada. Flexible Thinking: The Fascinating History of Wearable Electronics E Wearable electronics have been capturing much attention in the press, both technical and busi- ness, over the past few years. Articles for con- sumption by the public, as well as technical research papers on the topic, have been increas- ing steadily in recent times. However, wearable electronics are far from new. Moreover, the term "wearable" is quite fungible and encompasses a broad spectrum of prospective embodiments. Beyond Design: Designing for the SAP Fabrication Process E PCB designers are continually challenged with demands for reduced product size. However, form factor-driven design pressures have been relieved, in part, by the increased use of high- density interconnects (HDIs), which enable more functionality per unit area than conven- tional PCBs. Leveraging finer lines, thinner materials, and laser-drilled vias, HDIs have played a crucial role in device miniaturization. However, the traditional PCB subtractive etch processing becomes very difficult for feature sizes below 3 mil trace/space. is forces PCB designs to become more complex as electron- ics packages shrink—adding extra routing lay- ers, and microvia layers, and increasing the number of lamination cycles required, all of which impact yield, reliability, and thus cost.

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