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Page 88 of 109

175°C warp HRL3 245°C warp SAC305 ALPHA ® OM-565 HRL3 Solder Paste Low Temperature, High Reliability • Enhanced mechanical reliability over traditional SnBi solder pastes • Superior wettability minimizing warpage induced defects • Enabling peak re ow temperature of 175°C • Increases energy e• iciency and cost savings Minimize Warpage Induced Defects to Maximize Assembly Yield.

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