Issue link: https://iconnect007.uberflip.com/i/1470111
24 DESIGN007 MAGAZINE I JUNE 2022 will automatically Audit Report Correct Proceed based upon accessible, intelligent data and monitoring sensors throughout the life of the product. If you are a PCB designer or PCB project stakeholder of any discipline, I recommend studying subject matter regarding Industry 4.0, IPC's CFX (IPC-2591), data, sensors, the internet of things, and various articles on the topic of lights-out manufacturing. Your future designing with one another is well laid out and rather mind blowing, to say the least. Conclusion: The Next Acronyms New industr y paradigm shifts seem to be taking a toll on the future of our old "DF" acro- nyms. A few years ago, due to evolving technolo- gies and a need to better explain what the heck designers should design for, the term DFM had to scoot over so our industry could make room for its other DF acronyms: DFA (assembly), DFC (cost), DFT (test), etc. Not long aer, the industry seemed to realize that there just might be too many things to design for. We then watched as all the DFs suffered the humiliation of being lumped together into one big DF acro- nym with a cute little x added onto the end to represent all of them (DFX). But recently, just as it seemed as though all of this DF acronym jazz had started to set- tle down, folks in the industry have perhaps begun to see the folly of PCB designers designing for stakeholders with whom they have no visibility, no contact, and no con- straints. About a year ago, someone shouted, "How about you design with your other stake- holders!" Some clever marketeers in our midst must have thought "Well, duh!" I don't mean to sound cocksure, but just for fun over these next couple of years, I intend to watch how our industry treats this new acro- nym. e way it's already being perceived dif- ferently by various stakeholders in the indus- try, I predict it will go through much of the same treatment cycles as DFM. We will soon see design with fab, design with assembly, design with test, etc. en we will read about how all the DWs were merged into DWX and realize that our potential for seamless, trou- ble-free design and manufacturing is crippled because we continue to share non-intelligent, dumb data. en, as the script goes, we'll need a new acronym. What's next? With excitement we've been watching the electronics manufacturing industry begin to incorporate amazing technological advance- ments into their processes and machinery. e next industrial revolution, Industry 4.0, is interconnecting precision robotics, advanced materials, processes, and people which are being brought together to plan, purchase, design, manufacture, assemble, and test. e power of IPC's Connected Factory Exchange (IPC-2591) standard has been loudly on dis- play for the past few years on the IPC APEX EXPO show floor and the industry is engaging. Move over DFs, DWs and 5Ws, it appears that the CFX (Connected Factory Exchange) will be designing with the internet of things come Industry 4.0. DESIGN007 Kelly Dack, CIT, CID+, provides DFX-centered PCB design and manufacturing liaison expertise for a dynamic EMS provider in the Pacific Northwest while also serving as an IPC design certifi- cation instructor (CID) for EPTAC. To read past columns or contact Dack, click here. New industry paradigm shifts seem to be taking a toll on the future of our old "DF" acronyms.