Design007 Magazine

A-SAP ™ Averatek semi-additive process offers a 90% reduction in size and weight over current state-of-the-art with 15 micron (.6 mm) trace and space Smaller is better. More info on A-SAP™ www.averatek.com 19mm 6mm Typical capability in the USA today: 75 microns A-SAP™: 25 microns and below A-SAP ™ allows use of much smaller packages A-SAP ™ enables ultra-high electronics density

• Design007 Magazine — June 2022
• Feature Contents — DWM: Design With Manufacturing
• Additional Contents
• Column — Will DWM Unite the Product Development Family?
• Feature Interview — What Happens When You Assume?
• Feature Column — Designing With the 5Ws and Other Acronyms
• Feature Interview — Predictive Engineering: Happy Holden Discusses True DFM
• Feature Article — DWM: A Rose by Any Other Name
• Short — Column Excerpt: All Systems Go: Electronic Data Management—Can You Design Without It?
• PCB007 Highlights
• Feature Article — Mastering the Art of Communication With Manufacturers
• Short — Book Excerpt: The Printed Circuit Designers Guide to… Stackups—The Design within the Design
• Column — Bringing PCB Quoting into the 21st Century
• Feature Column — Is DWM Just Another Buzzword?
• Feature Article — Producing Diverse Designs in Concert With Manufacturing
• Column — Supply Chain Resilience, Part One: The Supply Chain Problem
• Column — An Overview of Copper Foils
• Short — SEMI Europe Honors Outstanding Leadership in Microelectronics
• Column — Optimize Your Thermal Management
• Column — The Many Benefits of Eliminating (Most) Solder
• Flex007 Highlights
• Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead