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info @ atotech.com w w w.atotech.com Make the exceptional your new standard! Printoganth ® MV TP2 – High throwing power with the best deposition structure The PCB industry is driven by the demands of next generation IC substrates. This creates requirements towards minimized surface copper thickness, while the copper in the micro vias must be maximized to ensure best coverage. Besides excellent coverage over the entire PCB panel, the deposit thickness must be uniform with optimal roughness, all of which are critical for SAP and amSAP manufacturing. Atotech's Printoganth ® MV TP2 meets all these requirements by providing superior throwing power with a low deposition thickness and an optimized deposition structure for fine lines and spaces of 10 μm and less. The process ensures a uniform textured copper layer which is ideal for low loss applications and enhanced dry film adhesion and can be used for mixed production facilities targeting both SAP and amSAP technologies. To find out more about Printoganth ® MV TP2, scan the QR-code to the right.