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JULY 2022 I SMT007 MAGAZINE 63 Microscopic analysis revealed complete wetting, continuous IMC (intermetallic com- pounds) formation and no micro-crack- ing with solder paste (Figure 7). e wetting perature gives complete wetting and no silver leaching. Too low or too high a temperature usually results in forming solder balls or silver leaching. Figure 5: Typical low soak profile for OM-550 HRL1 paste. Figure 6: Effect of peak reflow temperature on solder paste wetting on metallization pad. Figure 7: SEM cross-sectional analysis of solder joints formed, OM-550.