Issue link: https://iconnect007.uberflip.com/i/1472190
JULY 2022 I SMT007 MAGAZINE 65 and electroluminescence imaging (EL) were performed before and aer the tests. No deg- radation in module performance or other functional properties was noted (Figure 11). EL analysis also shows no evidence of crack- ing or other defects for both the pastes (Figure 12)—the maximum power (P max ) loss permis- sible according to IEC 61215 is ±5% aer the test. None of the samples reached this value. e maximum change in P max was less than 1% Figure 10: Peel test result of R276 and OM-550 HRL1 assembled soldered cells. Figure 11: Damp heat and thermal cycling results of OM550 HRL1 assembled minipanels. D: 1000 h damp heat test. T: 200 cycles thermal cycling test.