Design007 Magazine


Issue link:

Contents of this Issue


Page 33 of 95

34 DESIGN007 MAGAZINE I JULY 2022 Feature Interview by Nolan Johnson I-CONNECT007 Nolan Johnson recently spoke with Brad Gr iffin, product marketing director for Cadence Design Systems, about Cadence's Matrix solver technology. ey discuss its use as a multi-disciplinary field solver as well as Cadence's focus on thermal analysis and utiliz- ing the power of the cloud. Nolan Johnson: Brad, now more than ever you must make decisions in design that are going to impact manufacturing. Brad Griffin: I agree with you. Cadence is very uniquely positioned because we've always had PCB and IC packaging design tools. So much of what we used to do on a printed circuit board is now done in silicon on a silicon inter- poser. e tools that are used at the board and package level have had to evolve to be able to support the new types of designs. We're engaged through the whole process. at's where field solvers come in because if you're a printed circuit board designer and you're laying out a board, you may not even think about a 2D field solver running in the background, calculating impedance for you to tell you that you've met the 50 ohms of imped- ance that you were trying to get to. ose tools are embedded in the design tools, and the users don't even know they're running an EM solver. But as you get into more involved work, where you're sending 64 bits simultaneously at Cadence Provides 'Clarity' in Design Tool

Articles in this issue

Archives of this issue

view archives of Design007 Magazine - Design007-July2022