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JULY 2022 I DESIGN007 MAGAZINE 45 References 1. Beyond Design: "Predicting and Measuring Impedance," "It's a Material World," "Stackup Plan- ning Parts 1-6" 2. "Signal and Power Integrity—Simplified," by Eric Bogatin 3. Wikipedia: Electromagnetic field solvers. Barry Olney is managing director of In-Circuit Design Pty Ltd (iCD), Australia, a PCB design service bureau that specializes in board-level simulation. The company developed the iCD Design Integrity software incorporat- ing the iCD Stackup, PDN, and CPW Planner. The software can be downloaded at To read past columns, click here. which generally are accurate to better than 1%. • ere are many steps to get the fabrication process right, and the field solver is one of the most reliable links in the chain. • Using the exact materials that are stocked by your preferred fabricator can increase accuracy by up to 5%. • Materials, used for the fabrication of the multilayer PCB, absorb high frequencies, and reduce edge rates; that loss in the transmission lines is a major cause of signal integrity issues. • When each material is used for the right target application, the resultant PCB will have the lowest possible cost while still satisfying the design and performance goals of the project. • If dielectric constant values vary on differ- ent layers of the substrate then bus timing may also be an issue. DESIGN007 IPC is now accepting abstracts for IPC E-Textiles 2023, the international conference for the e-textiles industry, to be held live and in-person on Monday, January 23, 2023, in San Diego, California, in conjunc- tion with IPC APEX EXPO 2023, the industry's premier conference and exhibition for the electronics industry. IPC E-Textiles 2023 provides an excellent oppor- tunity for the e-textiles industry to learn, network, and collaborate on this vastly expanding technology space. By aligning IPC E-Textiles 2023 with IPC APEX EXPO, speakers and attendees will also have the opportunity to participate in IPC E-Textiles Committee standards meetings and take advantage of all events offered during IPC APEX EXPO. IPC invites innovators and technologists from the e-textiles supply chain and academia to submit an abstract for a technical presentation during the con- ference. The IPC E-Textiles 2023 Program Committee seeks abstracts in the following topic areas: • E-Textiles Success Stories • Reliability and Standards • Economic and Business Aspects • Futuristic Thinking A 250-word techni- cal conference abstract should describe signifi- cant results from exper- iments and case stud- i e s , e m p h a s i z e n e w t e c h n i q u e s , d i s c u s s trends of interest, and contain appropriate technical test results. Technical conference paper abstracts are due August 1, 2022. To submit an abstract or course pro- posal, visit IPC's website. IPC also announces the IPC E-Textiles 2023 Pro- gram Committee, which will shape the technical deliverables and format for this exciting and educa- tional event: • Vladan Koncar, Ph.D., University of Lille, Ecole Nationale Supérieure des Arts et Industries Textiles (ENSAIT) • Pratyush Rai, Ph.D., Nanowear, Inc. • Sahar Rostami, Myant • Yolita Wildman Nugent, Betazip, LLC (Source: IPC) IPC Issues Call for Participation in IPC E-Textiles 2023

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