Design007 Magazine

94 DESIGN007 MAGAZINE I JULY 2022 Our library is open 24/7/365. Visit us at: I-007eBooks.com Thermal Management: A Fabricator's Perspective by Anaya Vardya, American Standard Circuits Beat the heat in your designs through thermal management design processes. This book serves as a desk reference on the most current techniques and methods from a PCB fabricator's perspective. Stackups: The Design within the Design by Bill Hargin, Z-zero Finally, a book about stackups! From material selection and understanding laminate data- sheets, to impedance planning, glass weave skew and rigid-flex materials, topic expert Bill Hargin has written a unique book on PCB stackups. Get yours now! Flex and Rigid-Flex Fundamentals by Anaya Vardya and David Lackey, American Standard Circuits Flexible circuits are rapidly becoming a preferred interconnection technology for elec- tronic products. By their intrinsic nature, FPCBs require a good deal more understanding and planning than their rigid PCB counterparts to be assured of first-pass success. High Performance Materials by Michael Gay, Isola This book provides the reader with a clearer picture of what to know when selecting which material is most desirable for their upcoming products and a solid base for making material selection decisions. Get your copy now! NEW! Thermal Management with Insulated Metal Substrates, Vol. 2 by Didier Mauve and Robert Art, Ventec International Group This book covers the latest developments in the field of thermal management, particularly in insulated metal substrates, using state-of-the-art products as examples and focusing on specific solutions and enhanced properties of IMS. Add this essential book to your library. The Systems Designer's Guide to... System Analysis by Brad Griffin, Cadence In this book, the author, Brad Griffin of Cadence, focuses on EM and thermal analysis in the context of data center electronics systems. Be sure to also download the companion guide for end-to-end solutions to today's design challenges.

• Design007 Magazine — July 2022
• Feature Contents — Field Solvers
• Additional Contents
• Column — With Field Solvers, GIGO Hurts
• Feature Interview — Surveying the Land of Field Solvers
• Feature Article — The Great Divide in PCB Simulation Software
• Short — Book Excerpt: The Printed Circuit Designer's Guide to… Thermal Management with Insulated Metal Substrates, Volume 2
• Feature Column — Field Solver Finesse for Modelling Transmission Lines
• PCB007 Highlights
• Feature Interview — Cadence Provides 'Clarity' in Design Tool
• Infographic: Critical EV Battery Minerals
• Feature Column — 2D Field Solver—An Essential Tool for High-speed PCB Design
• Short — IPC Issues Cal for Participation in IPC E-Textiles 2023
• Column — Supply Chain Resilience, Part Two: The Solution
• Feature Article — The Practical Side of Using EM Solvers
• MilAero007 Highlights
• Article — Final Finishes—ENIG and ENIPIG
• Short — University of Illinois Researchers Create Low-cost, High-yield Plastic Microprocessors
• Column — Can Solvent-free UV Cure Coatings Increase Stability and Throughput?
• Short — All Sytems Go: Accelerate Your PCB Designs with Machine Learning
• Column — Manufacturing Documentation: Keep the Builder in Mind
• Flex007 Highlights
• Article — The Importance of Rigid-Flex PCB Design Guidelines
• Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines.