Issue link: https://iconnect007.uberflip.com/i/1472851
48 DESIGN007 MAGAZINE I JULY 2022 5. Product portfolio review 6. Sustaining engineering 7. All the way through to product end of life (EOL) One solution is needed that can be fully integrated with the electronic systems design platform, and that breaks through the invisible silos in organizations so that better cross-func- tional decisions can be made, especially during NPI when upward of 80% of lifecycle risks and costs are locked in. When deployed, this digitally integrated solution will reduce manual intervention, foster collaboration, improve transparency across disciplines, and reduce (or eliminate) respins between design and manufacturing. Fundamentally, this solution will "shi le" real-time component sourcing insights (e.g., cost, availability, lifecycle, compliance), in addition to performance and electrical para- metrics, to the engineer's desktop (Figure 3). is allows for more informed decisions at the point of part selection and the point of design while enabling seamless collaboration between engineering and the procurement team. In addition to component sourcing from approximately 100 suppliers, engineers and designers will be presented with alternates for target costs, and mitigating risk of down- stream supply disruptions. At the core of Sup- plyframe NPI (Figure 1) is global real-time availability and lead times for over 600 million component parts, plus billions of data signals captured about part supply, demand, risk, and commercial intent. is solution is geared toward supply chain professionals at OEMs and other global manufacturers. However, it's important to note that this is not the solution to "the problem" on its own. When we think about a complete supply- chain resilience solution (Figure 2), it needs to seamlessly connect the whole of a design organization with the electronics ecosystem (supply and manufacturing) they depend on to bring a successful product to market. At the heart of the solution is continuously updated, comprehensive component intelligence. For the design organization, this integrated source of AI-enabled data will be used to empower better decisions across the entire product life- cycle at the point of: 1. Component research and selection 2. Part creation 3. Design capture 4. e bill of materials (BOM) review and analysis Figure 1: Supplyframe Design-to-Source Intelligence Network.