Design007 Magazine

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• Design007 Magazine — July 2022
• Feature Contents — Field Solvers
• Additional Contents
• Column — With Field Solvers, GIGO Hurts
• Feature Interview — Surveying the Land of Field Solvers
• Feature Article — The Great Divide in PCB Simulation Software
• Short — Book Excerpt: The Printed Circuit Designer's Guide to… Thermal Management with Insulated Metal Substrates, Volume 2
• Feature Column — Field Solver Finesse for Modelling Transmission Lines
• PCB007 Highlights
• Feature Interview — Cadence Provides 'Clarity' in Design Tool
• Infographic: Critical EV Battery Minerals
• Feature Column — 2D Field Solver—An Essential Tool for High-speed PCB Design
• Short — IPC Issues Cal for Participation in IPC E-Textiles 2023
• Column — Supply Chain Resilience, Part Two: The Solution
• Feature Article — The Practical Side of Using EM Solvers
• MilAero007 Highlights
• Article — Final Finishes—ENIG and ENIPIG
• Short — University of Illinois Researchers Create Low-cost, High-yield Plastic Microprocessors
• Column — Can Solvent-free UV Cure Coatings Increase Stability and Throughput?
• Short — All Sytems Go: Accelerate Your PCB Designs with Machine Learning
• Column — Manufacturing Documentation: Keep the Builder in Mind
• Flex007 Highlights
• Article — The Importance of Rigid-Flex PCB Design Guidelines
• Top Ten Editor's Picks
• Career Opportunities section
• I-007e Educational Resource Center
• Advertiser Index and Masthead
• Problems Solved! Subscribe to Our Magazines.